Attrezzature

Corresponding to hybrid mounting including high-speed mounting of small LEDs and bare chips to flip chip mounting Modular High-Speed Mounter One NXT-H can simultaneously handle wafers, tray feeders, and tape feeders. By simply changing the feeding equipment, the feeding method can be completely switched (primarily tape feeding or primarily tray/wafer feeding). Based on a high-rigidity structural design, equipped with linear motor drive and high-function cameras. Achieves high-precision and high-quality mounting through advanced control technology and optimized pressure control. After installing HEPA filters, the machine's internal cleanliness reaches Class 1000. Designed for cleanroom use with dust-proof XY mechanisms. Configuring HEPA filters creates an optimal working environment for semiconductor components. Features a 15-inch large touchscreen and graphical interface. Integrates operation of the main unit and MWU12i. Supports both wafer map information management and format changes. ※User formats are individually configured.