Modular Placement Machine
• Unites technologies of our industry-leading CM-series into a lean modular solution
• Flexible solution accommodates production variations with ease
• Minimal investment for quick ROI
• Compatible with other CM-series equipment
| Main specification | |
|---|---|
| Equipment type 1 | SMT equipment |
| Equipment type 2 | Mounting equipment |
| Equipment type 3 | Pick-and-place machine |
| Equipment size | 1530×1807×1430mm |
| Equipment weight | 1720 kg (the host only) |
| Power source | AC 200 V/ 220 V ±10 V; 3-phase AC 380 V/ 400 V/ 420 V/ 480 V ±20 V；1400KVA |
| Gas source | 0.5 MPa, 150 L /min (A.N.R.) |
| Parameter | |
|---|---|
| Item | Spec |
| Max PCB size | 50 mm x 50 mm |
| Min PCB size | 460 mm x 360 mm |
| PCB EXCHANGE TIME | 4.0 s (When no components are placed on the back of the PCB) |
| Baseboard transfer time (seconds) | Below 3.5sec (Baseboard size: ~330 × 250mm) / Below 4.0sec(Baseboard size ：~460×360mm) |
| Baseboard Size L×W×T（㎜） | 50×50×0.3～460×250×4 50×50×0.3～460×360×4 |
| Number of varieties carried by Tape | 70 Slot/70 variety(8/12/16 ㎜)*8mm：Maximum 140 varieties(Double T/F spec.) |
| Placement accuracy | ||
|---|---|---|
| HIGH-SPEED (12 Nozzles) | HIGH-SPEED (LS8 Nozzles) | MULTI-FUNCTION(3 Nozzles) |
| 0.144 s/chip (for type A-2 head) | 0.19 s/chip (for type A-0 head) | 0.8 s/QFP (for type B head) |
| ±40 µm/chip (Cpk≥1) | ±50 µm/chip ±35 µm/chip (Cpk≥1) | ±50 µm/chip ±35 µm/chip (Cpk≥1) |
| 0402 (01005") chip to L12xW12xT6.5 | 0402 (01005") chip to L100xW50xT15 | 0603 (0201") chip to L100xW90xT25 |
| 25000CPH(theory) | 19000CPH(theory) | 7200CPH(theory) |
| 17000CPH(actual) | 14000CPH(actual) | 5000CPH(actual) |
High-speed multi-functionality with one beam and one head
Enhanced productivity of microchips
Includes latest functionality for high quality placement
Includes latest component support functionality
Excellent compatibility with CM-series
Incremental capacity with continuous evolution support
Electrical Parts
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