With Front Planks(MD-P200US)Compare, Raise11%Productive,Through the design of a high-intensity andICHigh-speed pick-up action, Maintenance of high-precision gills(±7μm/3σ)"and achievesMD-P200USCompare11%Increased productivity.
| Main specification | |
|---|
| Brand | Panasonic |
| Model | MDP200US2 |
| Type 1 | SMT Equipment |
| Type 2 | Soldering Equipment |
| Type 3 | |
| Size | W 1 340 * D 1 140 * H 1 400( |
| Weight | 1750KG |
| Voltage | San AC 200, 220, 380, 400, 420, 480 V 2.7 kVA |
| Rated power | |
| Gas source | 0.49±0.05Mpa |
| Operating System | |
| Other | |
| Parameters | |
|---|
| Productivity | 0.65 s/IC(Highest speed rewinding chip ultrasound, Including work time0.2s) |
| Load Precision | XY(3σ): ±7μm |
| Base size(mm) | L 50 * W 30 〜 L 120 * W 120 |
| Crystal Size(mm) | L 0.25 * W 0.25 〜 L 6 * W 6 |
| Crystal varieties | 1Types(Crystal round hand supply)/ Most12Types |
| Full load | VCMHeader Specification:1N ~ 50N |
| Workhead heating | Maximum Settings 300℃ |
| Base plate heating | Maximum Settings 300℃ Heat with constant heat |
| Power | San AC 200 V ±10 V,50/60 Hz,Scale Capacity1.7 kVA |
| Air pressure source | 0.4 ~ 0.5 Mpa(Max 0.8 MPa), 30 L /min |
| Device Dimensions(mm) | W 1 340 * D 1 140 * H 1 400 |
| Weight | 1 750 kg |
