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Artikkelit PANASONIC NPM-WXS Specification
Aika:2025-10-09 Vierailut:0
Panasonic's Next-Generation Mounting Manufacturing (X-Series) Concept "Smart Manufacturing"1. Autonomous functions for stable operation - Self-controlled production line2. Labor-saving & improved efficiency - Centralized control3. Minimize manual operation variability - Guidance & automated micro-features
| Main specification | |
| Equipment type 1 | SMT equipment |
| Equipment type 2 | Mounting equipment |
| Equipment type 3 | Pick-and-place machine |
| Equipment size | W 1,410*2 × D 2,570*3 × H 1,444*4 |
| Equipment weight | 2,660 kg (Main unit only, varies by optional configurations) |
| Power source | 3-phase AC 200/220/380/400/420/480V 2.1 kVA |
| Gas source | Min. 0.5 MPa, 200 L/min (A.N.R.) |
| Substrate dimensions (mm) | |
| Dual rail | Dual rail transport (full): L50×W50 ~ L750×W300Dual rail transport (dual-position): L50×W50 ~ L350×W300 |
| Dual rail | Single rail transport (full): L50×W50 ~ L750×W590Single rail transport (dual-position): L50×W50 ~ L350×W590 |
| Basic specifications | | |
| Lightweight 16-nozzle head V2 (per head) | 43,000 CPH (0.084 s/chip) | ±25 μm/chip |
| Lightweight 8-nozzle head (per head) | 23,000 CPH (0.155 s/chip) | ±25 μm/chip±40 μm/QFP (≤12mm)±25 μm/QFP (12-32mm) |
| 4-nozzle head (per head) | 8,400 CPH (0.429 s/chip)7,800 CPH (0.462 s/QFP feeder)7,100 CPH (0.507 s/QFP tray) | ±20 μm/QFP |
| 3-nozzle head V2 (per head) | 9,400 CPH (0.383 s/chip)7,300 CPH (0.493 s/QFP feeder)6,350 CPH (0.567 s/QFP tray) | ±20 μm/QFP |
| Component dimensions | |
| Lightweight 8-nozzle head (per head) | 0402 chip ~ L45×W45×T12 or L100×W40×T12 |
| 4-nozzle head (per head) | 0603 chip ~ L120×W90×T40 or L150×W25×T40 |
| 3-nozzle head V2 (per head) | 0603 chip ~ L120×W90×T40 or L150×W25×T40 |
| Component supply | |
| Rod | Front/rear 17-station exchange cart: Max.16 types (Single rod feeder) |
| Tray | Single-side tray: Max.24 types, Front/rear tray: Max.48 types |