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SUNEAST T3PLUS Solder Paste Printer

Marca dell\'attrezzatura: SUNEAST
Tipo di apparecchiatura: Solder Paste Printing & Jetting
Codice modello dell\'apparecchiatura: T3PLUS
Prezzo dell\'attrezzatura:
Dettagli del prodotto
T3 PLUSFull automatic tin ointment printer,Automatic balancing of razor pressure,Pressure adjusts.Smart2DTest function.Fuck,Wet cleaning option,Vacuum Cleaning(Match).Printable Thread(Match).AdvancedmarkPoint recognition technology and system stabilization technology.
Main specification
BrandSUNEAST
ModelT3PLUS
Type 1SMT Equipment
Type 2Solder Paste Printing & Jetting
Type 3Solder Paste Printer
Size1140x1380x1530mm(Standard)
WeightAbout900Kg
VoltageSingle AC 220V+10% (50/60HZ) ; About3kw
Rated power
Gas source4.5~6kg/cm2
Operating System
Other
Basic parameters
Steel web size(mm) 520(X)x420(Y)~737(X)x737(Y)
Steel web thickness20-40mm
MinPCBDimensions(mm)50(X)x50(Y)
MaxPCBDimensions(mm) 400(X)x310(Y)
PCBThicknessmm0.2~6(0.4mmHere's the cure)
Warp <1%(Diagonal measurements)
Back Widget HeightPCB10mm
Transfer height900±40mm
Support ModeMagnetic Top,Magnetic Top,Vacuum inhaler(Match)
Plugin MethodSide clip(Plot)
Side DistancePCBCraft side≥2.5mm
Transport speed0~1500mm/s, Incremental1mm
Transport belt typeUType Synchronized Tape
Staple MethodGas tank
Staple PositionBased onPCBSize Software SettingsPCBStop Location
Transfer DirectionLeft-Right,Right-Left,Left-Left,Right-Client pre-right exit appointment
Printing system
Ingon Speed5-200mm/sAlignable
Print HeaderStep up and down the motors
A razorSteel razor,A rubber razor(Optional)
Scratch angle60degrees
Scratch pressure0~20kg
Visual system
Break OutThree-part break,Speed:0.1-20mm/sDistance: 0-20mm
BitwiseMarkPoint automatic
CameraGermanyGermany BASLER, 13" CCD.640*480Pixels,Pixels Size5.6μmx5.6μm
ImageDouble up and down
Camera light Axis,Rings of light4It's a good road
Range 9mm*7mm
Mark Point Size The diameter or edge is1mm-2mmAllow deviation10%
Tag Point Shape Circle,Square,Arguments
Mark Point Location PCBBoard specialmarkorPCBWeldette
2DTest Plot
Precision
Scope of platform adjustmentsX=±3mm,Y=±7mm, θ=1.5°
Position precision±0.01mm
Print precision±0.025mm
Time
Loop Time<10s(Does Not Contain Printing,Clean Time)
Change Time<5min
New Program Time <10min
Control system
Computer Configuration Handheld,WindowsReal system
System LanguageMedium,English
Up and downSMEMA
User PermissionsUser password and advanced password setting
Cleaning system
Cleaning systemFuck,Wet(Plot),Vacuum Mode(Match)
Liquidity testing The liquid level automatically alerts
Match
Autogas capper For thin circuit boards(Thickness≤1mm)
Fixed Top+Side clipFor thin circuit boards(Thickness≤1mm)
Vacuum adsorption+Vacuum CleaningFor thin circuit boards or floppy panels
Automatically add cassiteriteAutomatically add cassiterite
AutomaticallyAutomaticallyPCBBoard,Elimination of manual board time and feeder costs,Controlled start or close
Soft, all-powerful!Gas)For Double SidePCBBoard support(The height of the substrate device≤9mm )
Automatic positioning of steel grids Automatic positioning of steel grids
PCBAutomatically adjust the thickness of the plate PCBAuto-adjusted plate thickness
Sprinter pressure feedback functionReal time feedback on scratch pressure
Air conditioningSelection or client purchase
Tin ointment monitoring system Tin ointment monitoring system
SPIOnlineSPIOnline
UPSPower outage protectionUPS 15Minute power outage protection
Industry4.0 Horse trace.Production analysis.Wait

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