YAMAHA In-Line SPI Solder Paste Inspection Machine YSi-SP
Equipment size (W*D*H): 904*1080*1478 (without light tower)
Equipment Weight: 550KG
Power Requirements.
Air Requirements: No air required
The Yamaha In-Line SPI Solder Paste Inspection Machine YSi-SP is a high-precision, high-speed solder paste print quality inspection machine for surface mount technology (SMT) production lines.Below are its key parameters, basic specifications and functional features:
Key parameters and basic specifications
Applicable PCB size:
L510×W460 mm～L50×W50 mm (single-channel specification, no dual-channel specification).
Horizontal resolution (FOV size):
25µm / 12.5µm (approx. 50 x 50 mm)
20µm / 10µm (approx. 40 x 40 mm)
15µm / 7.5µm (approx. 30 x 30 mm)
All are standard selection types.
High Resolution:
1µm。
Testing Program:
Solder paste print quality (volume, height, area and offset).
Power requirements:
Single phase AC200V-230V ±10%.
Air supply requirements:
No pneumatic specifications.
External Dimensions:
L904×W1,080×H1,478 mm。
Weight:
约550 kg。
Functional Features
"One Head Solution":
A single head can perform a variety of inspections, including high-speed and high-resolution inspections.
High-precision detection:
Unique measurement algorithms combining 2D and 3D enable highly accurate measurement of solder paste volume, height and area.
Machine-to-Machine Solutions (M2M):
Seamless coordination with other devices, such as automatic setting changes, print position feedback, etc.
Statistical Process Control (SPC):
Supports diverse statistical processing and saves all gasket images and measurement data.
Changes are set automatically:
Automatically sends production line PCB data and conveyor belt width settings by scanning IDs such as PCB barcodes.
Feedback print offset:
Sends feedback print offsets and cleaning cycles acquired by SPI to downstream printers.
Optional feature extensions:
Supports optional features such as super high resolution specification, adhesion check and foreign object check.
summarize
The Yamaha YSi-SP is an in-line SPI device that combines high accuracy, high speed, and versatility for in-line inspection of solder paste print quality on complex PCBs, and its unique "one-head solution" and high-precision algorithms allow it to excel in SMT production lines.
