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SEHO LEANSELECT Selective Soldering Machine

Equipement Mark: SEHO
Equipement Typ: Soldering Equipment
Equipement Modell Code: LEANSELECT
Equipement Präis:
Produit Detailer
The SEHO LeanSelect is particularly designed to meet these challenges, featuring highest flexibility and outstanding return of invest. While the entire process is fully automated, loading and unloading of assemblies is done manually on two separate conveyors. This allows processing of up to five carriers at the same time. The work stations are arranged in a counter-clockwise U-shape, thus consistently following the Lean Equipment Design Guidelines.
Main specification
BrandSEHO
ModelLEANSELECT
Type 1SMT Equipment
Type 2Soldering Equipment
Type 3Selective Soldering Machine
Size1450x1727x1345mm
Weight850KG
Voltage230/400V 50Hz 3P+N+PE/3x208V 60Hz 4P
Rated power
Gas sourceAir:R 1/4pipe 6~8bar/Nitrogen:R1/4pipe,4~8bar 1.5~2.0m³/H
Operating System
Other
Technical Data
ItemSpec
Design corresponding to lean equipment design guidelinesStandard
Carrier dimensions350x350mm
Number of carriers in process,Max5
Fluxer area
ItemSpec
Micro drop jet fluxerStandard
Fluxere head with several drop jet nozzlesOption
Flux typeAlcohol or water based
Solids contentUp to 5%(standard),optionally higher
Flux supply from original containerOption
Preheat area
ItemSpec
Bottom side pulsar or quartz heatingOption
Bottom side pulsar or quartz heating as second preheat staionOption
Pyrometer with gradient-controlled temperature profileOption
Heating circuit controlOption
Soldering area
ItemSpec
Electro-magnetic soldering unitStandard
Suitable for miniwave soldering or multiwave soldereing processesStandard
Automatic ultrasonic cleaning of solder nozzlesOption
Top side IR heating in the soldering areaOption
Solder poot volume10~15KG
Solder pot temperature320°C
Nitrogen operationStandard
Processing of lead-free and lead-containing solder alloysStandard
Cooling area
ItemSpec
Cooling stationOption
Automatic process control and programming
ItemSpec
Online teach system and offline teaching programOption
Automatic nozzle measurement and setup controlOption
Automatic opsition correction and z-height correctionOption
Automatic flux quantity monitoringOption
Automaitc wave height controlOption
Automatic solder level control and solder wire supplyOption
Nitrogen flow quantity control and monitoring of nitrogen qualityOption
Automated optical inspection(AOI)Option
Process visualization for minivwave solderingOption
McServer-Machine communication serverOption
Control unit
ItemSpec
Automatic PCStandard
Easy programming with comfortable user interfaceStandard
Zenium
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