Yamaha YAMAHA SMT Machine SIGMA Σ-F8S
Equipment Size(W*D*H): 1280×2240×1450mm
Equipment weight: 1940kg
Power Requirement: Three-phase AC200V ± 10%
Gas Requirement: 0.45 to 0.69MPa (4.6 to 7 kgf/cm2)
Equipment Description:
Features: ①Turret type mounting head realizes one mounting head to support mounting of multiple components, fully realizing fast, versatile and high operation rate ②The fully upgraded direct-drive mounting head realizes high-speed and high-precision mounting ③Rotary detection ④Intelligent operation ⑤Enriched application software
parameters | |
|---|---|
models | SIGMA-F8S |
4 high-speed mounting head specifications | 150,000 CPH (double track model) 136,000 CPH (single track model) |
Mounting accuracy | High-speed mounting head: 03015: ±25μm (3σ) 0603/0402: ±36μm (3σ) High-speed general-purpose mounting head: 03015: ±25μm (3σ) 0603/0402: ±36μm (3σ) |
Number of feeders | Up to 80 (converted from 8mmm tape) |
Number of mounting heads | 4个 |
Number of nozzles | 15pcs/patch head |
PCB Thickness | 0.3~5.0mm |
Object substrate size | |
|---|---|
Monorail models | L330×W250~L50×W50mm (Option: L381×W510~L50×W50mm) |
Two-track models | L330×W250~L50×W50mm |
Mounting head / range of mountable components | |
|---|---|
High-speed mounting head | 03015 chip～4.3×3.4mm(T:2.0mm) |
High-speed universal mounting head | 03015 Chip～33×33mm(T:12.7mm) |
Product Description | |
|---|---|
Rotation Detection | 1 Detection of the adsorption status, measurement of the component thickness feedback and adjustment of the placement height 2 Checking of the return of the placed components (checking of the nozzles prior to adsorption) 3 Automatic calibration that maintains the placement accuracy 4 Component center adsorption technology (feeder offset, pocket recognition, tracking of adsorption position corrections) |
intelligent operation (of computer) | 1 Spliceless tape feeder reduces operator workload, improves placement speed, and reduces placement difficulty (SL feeder) 2 Batch operation of the production line can be performed on any module (production line operation) 3 Various substrate information, such as bad board markers, is shared across the production line |
Rich application software | 1 Batch management of production line information, support for non-stop model switching 2 Batch management of production line information, bad board marking information, separation of substrate identification information 3 ACV (Advanced Component Validation) to check component mislabeling, forecast component exhaustion function, traceability function 4 Multi-model production line balancing 5 Link setup function, setup scheduling function |
