3 o'clockBefore the furnaceAOI,Behind the stoveAOI,SPIIntegrated monitoringShare information with stickerBad message to sticker,The sticker skips the board and pastesClosed loop control with printing pressTransfer Leaks andXYInformation such as axle offset to printer,Printing press automatically executes corresponding actionsMulti-machine interconnection,Industry-oriented4.0Centralized equipment management;Support for web versionSPC;Fingerprint recognition software and hardware modulePowerfulSPCReal timeSPCMonitoring and analysisData traceabilitySPCSystem & & ClientMESSystem Connection
| Main specification | |
|---|
| Brand | MAKER-RAY |
| Model | AIS630PD |
| Type 1 | SMT Equipment |
| Type 2 | SPI (Solder Paste Inspection) Machine |
| Type 3 | |
| Size | 1150X1630X1450mm |
| Weight | 1080KG |
| Voltage | AC220V 50HZ |
| Rated power | |
| Gas source | 0.5±0.05Mpa |
| Operating System | |
| Other | |
| Parameters | |
|---|
| PCBADimensions | Single Track50x50mm~510*610mmDouble Track50x50mm~510*330mm(Minimum distance between intermediate two orbits55mm) |
| PCBAThickness | 0.5mm~6mm |
| Widget Height | Top:25mm,Bottom:30mm |
| Camera | 4MPHigh-speed industrial camera |
| Light | RGBWFour-colour spectra source+2Directional structure light projection unit |
| FOV | 30*30mm |
| Resolution | 15μm |
| CPU | intel i7 |
| graphic cards | TokaRTX2060 8GOrganisation |
| Storage | 64GB DDR,240G SSD+2TMechanical Hard Disk |
| Orbital Widening | Automatic |
| Equipment doctrine | 3-D measurements of fine-printed welded steroids using phase-modulated contour measurement techniques,While ensuring high-speed measurements,Significant increase in measurement accuracy |
| Test content | Area,Volume,Shape,Offset ,Siu Tin,Dosik,Thickness,Li's and so on |
| Communication | StandardSMEMAInterface |
