MPM Edison II ACT(Automatic conversion technology)Based on maturity MPM Edison Platform development,The platform is the most accurate for the industry,Technically advanced printers.Internal ±8 Micro-machine's in position,and ±15 Microwet print precision (≥2 Cpk @ 6 sigma),Edison Wet print precision.Edison II ACT has more than 2Cpk and technological capacity,Available 0201 A system widget,To satisfy semiconductors,Vehicles,Ideal solutions to the growing challenge of miniaturization and the density of circuit plate components in areas such as smart equipment.Production line conversion is the most labour-intensive of electronic manufacturing,One of the most time-consuming and vulnerable tasks.It's an innovation MPM Patent automatic conversion technology (ACT) It provides a simple way of achieving the ultimate goal of plant automation,Economically efficient and progressive solutions.
| Main specification | |
|---|
| Brand | MPM/Speedline |
| Model | EdisonIIACT |
| Type 1 | SMT Equipment |
| Type 2 | Solder Paste Printing & Jetting |
| Type 3 | Solder Paste Printer |
| Size | W1280 * D1440 * H1589 mm |
| Weight | 806kg |
| Voltage | 200~240VAC+/-10% 50/60Hz 15A |
| Rated power | |
| Gas source | 90 psi at 4 cfm (Standard operating model) to 18 cfm (Vacuum Wipe) (6.20 bar @ 1.9 L/s to 8.5 L/s), 12.7 mm (0.5") A diameter tube |
| Operating System | |
| Other | |
| Baseboard Processing | |
|---|
| Item | Specifications |
| Maximum base size | 450x350mm |
| Minimum base plate size | 50x50mm |
| Baseboard thickness | Foil Clamps:0.2~6mm/Edge Loc:0.8~6mm |
| Maximum base weight | 4.5kg |
| Blank Edge | 3.0mm |
| Bottom gap | 12.7mm |
| Plugin hold | Fixed Top,Workstation vacuum,(Match:EdgeLocEdge holding system) |
| Baseboard Support | Magnetic caps and support blocks |
